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Exposure field size considerations for yield
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Interaction of pattern orientation and lens quality on CD and overlay errors
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S. Bukofsky and C. Progler, "Interaction of Pattern Orientation and Lens quality on CD and Overlay Errors", Proc. SPIE 4000, 315 (2000)
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Advances in process overlay
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0036030173
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Advances in process overlay on 300mm wafers
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J.Staecker, S. Arendt, K. Schumacher, E. Mos, R. von Haren, M. van der Schaar, R. Edart, W. Demmerle, H. Tolsma, "Advances in Process Overlay on 300mm wafers", Proc. SPIE 4689, 927 (2002)
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F. Bornebroek, J. Burghoorn, J.S. Greeneich, H.J. Megens, D. Satriasaputra, G. Simons, S. Stalnaker, B. Koek, "Overlay performance in advanced processes", Proc. SPIE 4000, 520 (2000)
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8
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Overlay performance on tungsten CMP layers using the ATHENA alignment system
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G. Rivera, L. Rozzoni, E. Castellana, G. Miraglia, P. Lam, J. Plauth, A. Dunbar, M. Phillips, "Overlay performance on tungsten CMP layers using the ATHENA alignment system", Proc. SPIE 4000, 428 (2000)
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R. Seltmann, W. Demmerle, M. Staples, A.M. Minvielle, B. Schulz, S. Muehle, "Overlay budget considerations for an all scanner fab", Proc. SPIE 4000, 896 (2000)
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10
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Overlay registration target design for wafer-induced shift characterization
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A.L. Ihochi and A.S. Wong, "Overlay Registration target design for wafer-induced shift characterization", Proc. SPIE 4689, 706 (2002)
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