New method for the quantitative evaluation of wafer pattern shape based on CAD data

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5038 I, Issue , 2003, Pages 540-546

  Matsuoka, Ryoichi ^a   Takahashi, Masanori ^a   Uemoto, Atsushi ^a  

^a SEIKO INSTRUMENTS INC   (Japan)

Author keywords

CAD data; Pattern shape evaluation; SEM

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; COMPUTER INTEGRATED MANUFACTURING; DEFECTS; INTEGRATED CIRCUIT LAYOUT; LOGIC CIRCUITS; PRODUCT DEVELOPMENT; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE;

PHASE SHIFT MASK; WAFER PROCESS;

LITHOGRAPHY;

EID: 0141723651     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.483688     Document Type: Conference Paper

References (1)

1. Mr. Watanabe and Mr. Sugimoto: Electronic material (2000.11)