Present state in research and the development trend in industrialization of PIM W-Cu composites

Fenmo Yejin Jishu/Powder Metallurgy Technology

Volumn 21, Issue 2, 2003, Pages 108-110

  Li, Yunping ^a   Qu, Xuanhui ^a   Zheng, Zhoushun ^a   Lei, Changming ^a   Duan, Baihua ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Infiltration; Powder injection molding (PIM); Thermal conductivity; Thermal expansion coefficient; W Cu composites

Indexed keywords

FORMING; INFILTRATION; MOLDING; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

INDUSTRIALIZATION; POWDER INJECTION MOLDING; POWDER METALLURGY PROCESS; THERMAL EXPANSION COEFFICIENT;

COMPOSITE MATERIALS;

EID: 0141648316     PISSN: 10013784     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Jin-Chun Kim, Sung-Soon Ryu, Hyok Lee, et al. Metal injection molding of Nanostructured W-Cu composite powder. International Journal of powder metallurgy, 35(4), 1999: 47-55.
2. Yang B, German R M. Powder Injection Molding and Infiltration Sintering of superfine Grain W-Cu. The international Journal of powder metallurgy, 1997, 33(4): 55-63.
3. Kim T H, Byeon J and Lee J S. A new production route for near net shaped full density W-Cu materials. Advances in Powder Metallurgy v 2 Jun 21-26 1992 sponsored by: Metal Powder Industries Federation: American Powder Metallurgy Inst Publ by Metal Powder Industries Federation: 431-438.
4. Yoon Eui Sikyu, Ji-Hun. Densification and microstructure of the PIMed W-15 wt% Cu nanocomposite powder. Funtai Oyobi Fummatsu Yakin/Journal of the Japan Society of Powder and Powder Metallurgy, 46(8): 1999: 898-903
5. Kim B K, Hong S H. Densification of W/Cu Nanocomposite. Proceedings of 2000 powder metallurgy world congress, Korea: 1461-1464.