Electromagnetic force in electric glass melting

Glass Science and Technology

Volumn 76, Issue 4, 2003, Pages 190-194

  Hofmann, Otto R ^a  

^a Fachbereich Grundlagenwissenschaften   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRODES; ELECTROMAGNETIC FIELD EFFECTS; FLOW OF SOLIDS; MELTING; PHASE INTERFACES;

BIOT-SAVART LAW; ELECTRIC GLASS MELTING; LORENTZ FORCE;

GLASS;

EID: 0141522778     PISSN: 09467475     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. Ladr, I.; Süsser, V.: Use of magnetohydrodynamic effects to homogenize the glass melt. (Orig. Czech.) In: Proc. 4th Conference on Electric Melting of Glass, Usti nad Labem (CSSR) 1974, Vol. 1, pp. 40-45.
2. Carbon, J.: Possible use of magnetohydrodynamic phenomena in the glass industry. (Orig. pol.) Szklo Ceram. 30 (1979) pp. 274-278.
3. Fekolin, V.N.; Stupak, F. A.: The application of the magnetohydrodynamic effect to the agitation of glass. Glass Ceram. 41 (1984) no. 12, pp. 10-12.
4. Stanek, J.: Electric Melting of Glass. New York et al.: Elsevier, 1977. Pp. 269-272.
5. Hofmann, O. R.; Philipp, G.: Importance of the Lorentz force in electrically heated glass melts. Glastech. Ber. 65 (1992) no. 5, pp. 142-149.
6. Hofmann, O. R.; Kaliski, H.: Die elektromagnetische Kraftwirkung auf die Glasschmelze in Elektrodennähe. Silikattechnik 42 (1991) no. 1, pp. 19-21.
7. Choudhary, M. K.: Mathematical modelling of MHD and buoyancy driven flow in electric furnaces. In: Proc. 2nd International Seminar on Mathematical Simulation in Glass Melting, Vsetin-Horni Becva (Czech Rep.) 1993. Pp. 87-98.
8. Choudhary, M. K.: A modelling study of flow and heat transfer in the vicinity of an electrode. In: Proc. XVII International Congress on Glass, Beijing 1995. Beijing: Chinese Ceram. Soc., 1995. Vol. 6, Pp. 100-107.
9. Hofmann, O. R.; Thess, D. A.: Elektromagnetische Beeinflussung der Glasbadströmung - Ein neues Anwendungsgebiet der Magnetohydromechanik. Glas-Ing. (2002) no. 1, pp. 39-45.