TMAH soak process optimization with DNQ positive resist for lift-off applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5039 II, Issue , 2003, Pages 1304-1311

  Mullen, Salem ^a   Toukhy, Medhat ^a   Lu, PingHung ^a   Dixit, Sunit ^a   Sellers, Paul ^a  

^a CLARIANT CORPORATION   (United States)

Author keywords

Cusp; Developer; I line; Lift off; Metal deposition; Overhang; Photoresist; Soak; Surface inhibition

Indexed keywords

DEPOSITION; LITHOGRAPHY; MICROELECTRONIC PROCESSING; PROCESS ENGINEERING; SILICON WAFERS; THERMAL EFFECTS;

CRITICAL DIMENSION; POSITVE RESIST; SOAK PROCESS OPTIMIZATION;

PHOTORESISTS;

EID: 0141499161     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.485198     Document Type: Conference Paper

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