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Volumn 5037 I, Issue , 2003, Pages 358-369

Candidate plasma-facing materials for EUV lithography source components

Author keywords

Debris reduction; EUV source; Plasma facing components; Thermal shock resistance

Indexed keywords

COMPUTER SIMULATION; ELECTRIC DISCHARGES; ELECTRIC INSULATORS; ELECTRODES; EVAPORATION; LASER PRODUCED PLASMAS; MELTING; PLASMA GUNS; SPUTTERING; THERMAL LOAD; ULTRAVIOLET RADIATION;

EID: 0141497114     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.484928     Document Type: Conference Paper
Times cited : (2)

References (21)
  • 15
    • 0141842343 scopus 로고    scopus 로고
    • Tungsten-Copper Elkonite® Materials by CMW Inc.
    • Tungsten-Copper Elkonite® Materials by CMW Inc., http://www.cmwinc.com/TechInfo/cuwelk.htm
  • 16
    • 0141507638 scopus 로고    scopus 로고
    • THERMKON® Heat Transfer Materials by CMW Inc.
    • THERMKON® Heat Transfer Materials by CMW Inc., http://www.cmwinc.com/TechInfo/thermkon.htm
  • 17
    • 0141507640 scopus 로고    scopus 로고
    • OSRAM SYLVANIA. Chemical & Metallurgical Products - Tungsten Copper Powders
    • OSRAM SYLVANIA. Chemical & Metallurgical Products - Tungsten Copper Powders, http://www.sylvania.com/pmc/chem/tmp.htm
  • 18
    • 0141619026 scopus 로고    scopus 로고
    • ZENTRIX Technologies
    • ZENTRIX Technologies, http://www.zentrix.com
  • 19
    • 0141842342 scopus 로고    scopus 로고
    • Spectra-Mat, Inc.
    • Spectra-Mat, Inc., http://www.spectramat.com


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.