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Volumn 80, Issue 7-8, 2003, Pages 435-440
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Effect of microstructure on the characterization of creep crack growth rate and rupture in TiAl intermetallic alloys
a
IHI CORPORATION
(Japan)
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Author keywords
Creep crack growth; Creep ductility; Creep life prediction; Q* parameter; Round Robin test; TiAl intermetallic compound
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Indexed keywords
BRITTLENESS;
CRACK PROPAGATION;
DUCTILITY;
INTERMETALLICS;
METALLOGRAPHIC MICROSTRUCTURE;
TITANIUM ALLOYS;
INTERMETALLIC ALLOYS;
CREEP;
ALUMINUM ALLOY;
BRITTLE MEDIUM;
CRACK PROPAGATION;
CREEP;
HIGH TEMPERATURE;
MICROSTRUCTURE;
TITANIUM ALLOY;
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EID: 0141483590
PISSN: 03080161
EISSN: None
Source Type: Journal
DOI: 10.1016/S0308-0161(03)00098-X Document Type: Article |
Times cited : (7)
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References (15)
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