Etching characteristics of porous silica (k = 1.9) in neutral loop discharge plasma

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 21, Issue 4, 2003, Pages 1344-1349

  Morikawa, Yasuhiro ^a   Mizutani, Naoki ^a   Ozawa, Masanori ^a   Hayashi, Toshio ^a   Chen, Wei ^a   Uchida, Taijiro ^a  

^a ULVAC INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FLUORINE CONTAINING POLYMERS; MASS SPECTROMETRY; POROUS MATERIALS; SILICA; X RAY PHOTOELECTRON SPECTROSCOPY;

THERMAL OXIDES;

PLASMA ETCHING;

EID: 0141458287     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1587137     Document Type: Conference Paper

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