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Volumn , Issue , 2003, Pages 107-115
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Towards a Halogen-Free Package - GREEN Molding Compound
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
ANTIMONY;
FLAME RETARDANTS;
MOISTURE CONTROL;
SEMICONDUCTOR DEVICE MANUFACTURE;
ANTIMONY COMPOUNDS;
CHARACTERIZATION;
CHIP SCALE PACKAGES;
ELECTRONICS PACKAGING;
ENCAPSULATION;
HALOGEN COMPOUNDS;
HALOGEN ELEMENTS;
HAZARDS;
INDUSTRIAL ELECTRONICS;
MANUFACTURE;
MATERIALS TESTING;
MOLDING;
PACKAGING MATERIALS;
SEMICONDUCTOR DEVICE TESTING;
SEMICONDUCTOR MATERIALS;
SHEET MOLDING COMPOUNDS;
STRESSES;
TEMPERATURE;
TESTING;
THERMAL CONDUCTIVITY;
THERMAL EXPANSION;
THERMAL STRESS;
GREEN PACKAGING;
ELECTRONICS PACKAGING;
SEMICONDUCTOR DEVICES;
AUTOMOTIVE APPLICATIONS;
FLAME RETARDANT SYSTEM;
GREEN MOLDING COMPOUNDS;
MATERIAL CHARACTERISATION;
SEMICONDUCTOR DEVICE PACKAGING;
SEMICONDUCTOR MANUFACTURING;
THERMAL-MECHANICAL SIMULATIONS;
THERMOMECHANICAL PROPERTIES;
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EID: 0141453856
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (9)
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References (4)
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