Encapsulation of the micromachined air-suspended inductors

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2003, Pages 1637-1640

  Choi, Yun Seok ^a   Yoon, Euisik ^a   Yoon, Jun Bo ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; INTEGRATED CIRCUITS; MICROMACHINING; MICROSTRUCTURE; PERMITTIVITY; Q FACTOR MEASUREMENT; SPIN COATING;

ELECTRICAL PERFORMANCE;

ELECTRIC INDUCTORS;

EID: 0043093729     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. J.-B. Yoon, Y.-S Choi, B.-I Kim; Y.Eo, E. Yoon, "CMOS-Compatible Surface-Micromachined Suspended-Sprial Inductors for Multi-GHz Silicon RF IC " in IEEE Electron Device Letters, vol. 23, pp. 591-593, Oct. 2002.
2. J.Y. Park, M.G. Alien, "High Q spiral-type microinductors on silicon substrates", in IEEE Trans. Magnetics, vol. 35, pp. 3544-3546, 1999.
3. J.-B. Yoon, B.-I. Kim, Y.-S. Choi, and E. Yoon, "3-D Construction of Monolithic Passive Components for RF and Microwave ICs Using Thick-Metal Surface Micromachining Technology", in IEEE Trans. Microwave Theory and Techniques, vol. 51, No. l, pp. 279-288, Jan. 2003
4. J.-B. Yoon, B.-I. Kim, Y.-S. Choi, and E. Yoon, "3-D lithography and metal surface micromachining for FR and microwave MEMS," in IEEE Int. MEMS Conf., 2002, pp. 673-676.
5. X. Huo, C. K.J. Chan, P.C.H Chan, "Silicon-based high-Q inductors incorporating electroplated copper and low-K BCB dielectric," IEEE Electron Device Letters, vol. 23, pp. 520-522, 2002