Design techniques to combat process, temperature and supply variations in bluetooth RFIC

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers

Volumn , Issue , 2003, Pages 551-554

  Theng Tee, Y ^a   Hwa Seng, Y ^a   Poh Boon, L ^a   Kwang Hung, T ^a   Tachi, S ^a   Soo Ling, K ^a   Murakami, T ^a   Jin Hui, S ^a   Choon Tiong, L ^a   Lin Choon, T ^a   Wing Kheng, W ^a   Qi Jun, X ^a   Chiao Meng, L ^a   Shio Hwi, L ^a   Wei, X ^a   Itoh, M ^a  

^a Wipro Techno Centre Singapore Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BIT ERROR RATE; CMOS INTEGRATED CIRCUITS; RADIO WAVES; THERMAL EFFECTS; TRANSCEIVERS;

LOW NOISE AMPLIFIER (LNA);

INTEGRATED CIRCUIT LAYOUT;

EID: 0043091786     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Specifications of the Bluetooth System, Version 1.0B, December 1999
2. J. Crols and M. Steyaert, CMOS Wireless Transceiver Design. Kluwer Academic Publishers, 1997