Evaluation of electrically disbonding adhesive properties for use as separation systems

Collection of Technical Papers - AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference

Volumn 1, Issue , 2003, Pages 332-341

  Welsh, Jeffry S ^a   Higgins, John E ^a   Gilbert, Michael D ^b   Cogan, Stuart F ^b  

^a AIR FORCE RESEARCH LABORATORY   (United States)

^b EIC LABORATORIES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; AERODYNAMICS; BONDING; ELECTRIC FIELD EFFECTS; EPOXY RESINS; JET AIRCRAFT; MECHANICAL TESTING;

ELECTRICALLY DISBONDING ADHESIVE PROPERTIES; EPOXY BOND; LOW VOLTAGE CURRENT; SEPARATION SYSTEMS;

AIRCRAFT PARTS AND EQUIPMENT;

EID: 0043014877     PISSN: 02734508     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2514/6.2003-1436     Document Type: Conference Paper

References (4)

1. Gilbert, M.D., and Hines, J.C., "Electrocleavable Epoxy Thermosets: On-Demand Release Adhesives," Final Report - Contract No. F08635-96-C-0026, Eglin AFB, FL, January 2001.
2. "Standard Test Method for Lap Shear Adhesion for Fiber Reinforced Plastic (FRP) Bonding," ASTM Standard D 5868-01, American Society for Testing and Materials, West Conshohocken, PA, 2001.
3. "Standard Test Method for Flatwise Tensile Strength of Sandwich Constructions," ASTM Standard C-297-94, American Society for Testing and Materials, West Conshohocken, PA, 1999.
4. "Instructions for ElectRelease™ E4 and ElectRelease™ M," Rev 2, EIC Laboratories, Inc., Norwood, MA, August, 2000.