AC impedance studies of copper doped silica glass

Materials Chemistry and Physics

Volumn 82, Issue 2, 2003, Pages 295-300

  Szu, Sung Ping ^a   Lin, Chung Yi ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

AC impedance; Copper; Silica glass; Sol gel

Indexed keywords

COPPER; DOPING (ADDITIVES); ELECTRIC IMPEDANCE; RELAXATION PROCESSES; SILICA; SOL-GELS; THERMAL EFFECTS;

SILICA GLASSES;

GLASS;

EID: 0043011807     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(03)00220-7     Document Type: Article

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