Plasma-deposited dielectrics for Cu metallization systems

Surface and Coatings Technology

Volumn 98, Issue 1-3, 1998, Pages 948-952

  Vogt, M ^a   Kachel, M ^a   Melzer, K ^a   Drescher, K ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Barrier; Cu metallization; PECVD; Silicon nitride; Silicon oxide

Indexed keywords

EID: 0042783442     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(97)00307-1     Document Type: Article

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