Production of Binderless Board and Cup by Compressive Shaping of Lumber Chip

Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C

Volumn 67, Issue 662, 2001, Pages 3305-3310

  Yokomizo, Taiju ^a   Nishimura, Hisashi ^a  

^a TOKYO METROPOLITAN UNIVERSITY   (Japan)

Author keywords

Binderless Board; Compressed Wood; Conformability; Cup; Lumber Chips; Molding Methods; Plastic Working; Press Working; Recycling; Wood Material

Indexed keywords

EID: 0042776136     PISSN: 03875024     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaic.67.3305     Document Type: Article

References (1)

1. Satoshi Suzuki, Hiroyuki Shintani, Seung-Young Park, Kyoko Saito, Nikhom Laemsak, Motoaki Okuma and Kenji Liyama: Holzforschung, 52 (1998), 417–426