Assembly sequence planning and assembling simulation of stamping die tools

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4756, Issue , 2002, Pages 274-279

  Yang, Xinhua ^a   Ou, Zongying ^a   Lu, Peide ^b   Han, Feng ^b  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b Changchun Carriage Factory   (China)

Author keywords

Assembly Model; Planning; Simulation; Subassembly partition

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER AIDED MANUFACTURING; COMPUTER SIMULATION; PRODUCT DESIGN; STAMPING;

SUBASSEMBLY PARTITION;

ASSEMBLY;

EID: 0042731784     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.498001     Document Type: Conference Paper

References (5)

1. Ishii, K., Life-cycle engineering design [J], ASME Trans, Journal of Mechanical Design, 1995,117(6): 42-47
2. Winfried van Holland, Assembly features in modeling and planning, Robotics and Computer Integrated Manufacturing, 16(2000), 277-294
3. J.D. Xu, A move-to-contact facility for modeling mechanical assembly and simulation, International Journal of Machine Tools & Manufacture, 39 (1999) 683-704
4. Mosemann, H., Wahl, F.M., Automatic decomposition of planned assembly sequences into skill primitives, Robotics and Automation, IEEE Transactions on, Vol.17, Issue: 5, Oct 2001, Page(s): 709-718
5. Dorador, J.M.; Young, R.I.M., Information models to support the interaction between design for assembly and assembly process planning, Assembly and Task Planning, 1999.(ISATP '99) Proceedings of the 1999 IEEE International Symposium on, 1999 Page(s): 39-44