Liquid crystal polymer-based integrated passive development for RF applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2003, Pages 1155-1158

  Davis, M F ^a   Yoon, S W ^a   Pinel, S ^a   Lim, K ^a   Laskar, J ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDPASS FILTERS; DIELECTRIC WAVEGUIDES; ELECTRIC LINES; INSERTION LOSSES; NATURAL FREQUENCIES; PERMITTIVITY;

BAND MODULES;

LIQUID CRYSTAL POLYMERS;

EID: 0042593143     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. K. Brownlee, P. Raj, S.K. Bhattacharya, K. Shinotani, C.P. Wong, R. Tummala, "Evaluation of liquid crystal polymers fro high performance SOP applications," 2002 Electronic Components and Technology Conference, pp. 676-680.
2. K. Jayaraj, T. E. Noll, "RF characterization of a low cost multichip packaging technology for monolithic microwave and millimeter wave integrated circuits," Signals, Systems, and Electronics, ISSSE '95, Proceedings, pp 443-446, 1995.
3. M. F. Davis, A. Sutono, K. Lim, J. Laskar, R. Tummala, "Multi-Layer Fully Organic-Based system on Package(SOP) Technology for RF Applications," IEEE EPEP Digest, pp. 103-106, Oct 2001.
4. S. H. Lee, et al, "High performance spiral inductors embedded n organic substrates for SOP applications IEEE MTT-S Int. Microwave Symp., pp. 2229-2232, June 2002.
5. M.F. Davis, et al., "RF-Microwave multi-band design solutions for multilayer organic system on package integrated passives," IEEE MTT-S Int. Microwave Symp., pp. 2217-2220, June 2002.