Relaxation of extrinsic and intrinsic stresses in germanium substrates with silicon films

Thin Solid Films

Volumn 320, Issue 2, 1998, Pages 260-263

  Madras, Cynthia G ^a   Wong, Peter Y ^a   Miaoulis, Ioannis N ^a   Goldman, Lee ^b   Korenstein, Ralph ^b  

^a Tufts University   (United States)

^b RAYTHEON COMPANY   (United States)

Author keywords

Germanium; Heat treatment; Sputtering; Stress

Indexed keywords

HEAT TREATMENT; ION BEAMS; MAGNETRON SPUTTERING; PLASTIC DEFORMATION; SEMICONDUCTING GERMANIUM; SEMICONDUCTING SILICON; SPUTTER DEPOSITION; STRESS ANALYSIS; STRESS RELAXATION; SUBSTRATES; VAPOR DEPOSITION;

COMPRESSIVE STRESSES; PHYSICAL VAPOR DEPOSITION (PVD);

SEMICONDUCTING FILMS;

EID: 0042579576     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)00679-2     Document Type: Article

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