Mechano-chemical polishing of silicon wafers

Journal of Materials Processing Technology

Volumn 140, Issue 1-3 SPEC., 2003, Pages 373-378

  Chen, Chao Chang A ^a   Shu, Li Sheng ^a   Lee, Shah Rong ^b  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NONE

Author keywords

Chemical mechanical polishing; Mechano chemical polishing; Silicon wafer planarization; Sub surface damage

Indexed keywords

ABRASIVES; ATOMIC FORCE MICROSCOPY; CHEMICAL POLISHING; CHEMICAL WASTES; ENVIRONMENTAL PROTECTION; INTEGRATED CIRCUITS; SURFACE ROUGHNESS;

MECHANICAL EFFECTS; SLURRY CONCENTRATIONS;

SILICON WAFERS;

EID: 0042410894     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(03)00827-6     Document Type: Conference Paper

References (9)

1. Yasunaga N. Effect of solid state reaction on wear of sapphire sliding on steel. J. JSPE. 44:1978;65-71.
2. H. Vora, Mechano-chemical Polishing of Silicon Nitride, Communications of the American Ceramic Society, 1982, pp. 140-141.
3. Suzuki K. Development of a new mechano-chemical polishing method with a polishing film for ceramic round bars. Ann. CIRP. 41:1992;339-342.
4. Tani Y. Development of high-concentration lapping discs with low bonding strength and their application to mirror finishing of brittle materials. JSME Int. J., Series C. 36(2):1993;264-270.
5. F.W. Preston, The theory and design of plate glass polishing machine, J. Soc. Glass Technol. (1927) 214-256.
6. Front End Process, ITIS Road Map, 2001, 10 pp.
7. A.R. West, Solid State Chemistry and its Applications, Zhuang Yuan Publisher, 1985.
8. T.-K. Kao, Ultra Precision Machining, Chan Hwa Scientific & Technology Book Co., 2000.
9. C.-C.A. Chen, L.-S. Hsu, C.-K. Hsu, W.-C. Liu, Study on pad dressing process for CMP of silicon wafers, in: Proceedings of the Third International Conference of European Society of Precision Engineering and Nanotechnology (EUSPEN 2002), Eindhoven, Holland, May 2002.