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Volumn 18, Issue 4, 2002, Pages 231-244
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Understanding puncture resistance and perforation behavior of packaging laminates
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Author keywords
BOPP film; Laminates; Layer position; Packaging; Probe; Puncture resistance
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Indexed keywords
COMPOSITION;
LOAD TESTING;
PACKAGING MATERIALS;
PLASTIC FILMS;
STRENGTH OF MATERIALS;
LAYER POSITION;
PACKAGING LAMINATES;
PERFORATION;
PREMATURE RUPTURE;
PUNCTURE MECHANISM;
PUNCTURE RESISTANCE;
LAMINATES;
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EID: 0042388266
PISSN: 87560879
EISSN: None
Source Type: Journal
DOI: 10.1177/8756087902033865 Document Type: Article |
Times cited : (13)
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References (6)
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