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Volumn 18, Issue 4, 2002, Pages 231-244

Understanding puncture resistance and perforation behavior of packaging laminates

Author keywords

BOPP film; Laminates; Layer position; Packaging; Probe; Puncture resistance

Indexed keywords

COMPOSITION; LOAD TESTING; PACKAGING MATERIALS; PLASTIC FILMS; STRENGTH OF MATERIALS;

EID: 0042388266     PISSN: 87560879     EISSN: None     Source Type: Journal    
DOI: 10.1177/8756087902033865     Document Type: Article
Times cited : (13)

References (6)
  • 1
    • 84970648230 scopus 로고
    • Slow rate penetration of packaging films
    • Seyler, R. (1990). Slow Rate Penetration of Packaging Films, J. Plastic Film & Sheeting, 6: 191.
    • (1990) J. Plastic Film & Sheeting , vol.6 , pp. 191
    • Seyler, R.1
  • 4
    • 4243505891 scopus 로고
    • Durchstoßversuch mit elektronischer meßwerterfassung
    • DIN 53373; Deutsche Institut für Normung
    • DIN 53373 (1970). Durchstoßversuch mit elektronischer meßwerterfassung, Deutsche Institut für Normung.
    • (1970)
  • 5
    • 84938232053 scopus 로고
    • Measurements on the resistance of flexible packaging materials to puncture, abrasion, and flexure and the relationship of those measurements to the performance of packages subjected to conditions causing pinhole formation
    • Report, US Army Natick Laboratories, Natick, Massachusetts
    • Hu, K.H. (1973). Measurements on the Resistance of Flexible Packaging Materials to Puncture, Abrasion, and Flexure and the Relationship of those Measurements to the Performance of Packages Subjected to Conditions Causing Pinhole Formation, Report, US Army Natick Laboratories, Natick, Massachusetts.
    • (1973)
    • Hu, K.H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.