Novel photoresist stripping technology using ozone/vaporized water mixture

IEEE Transactions on Semiconductor Manufacturing

Volumn 16, Issue 3, 2003, Pages 401-408

  Abe, Hitoshi ^a   Iwamoto, Hayato ^a   Toshima, Takayuki ^b   Iino, Tadashi ^b   Gale, Glenn W ^b  

^a SONY CORPORATION   (Japan)

^b TOKYO ELECTRON LTD   (Japan)

Author keywords

Ozone; Photoresist removal; Wafer cleaning

Indexed keywords

BINARY MIXTURES; CLEANING; ETCHING; FREE RADICALS; ION IMPLANTATION; OZONE; PHOTORESISTS; SILICON WAFERS; WATER;

PHOTORESIST REMOVAL; PHOTORESIST STRIPPING TECHNOLOGY; VAPOR OZONE STRIP; WAFER CLEANING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0042386780     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2003.815620     Document Type: Article

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