Laser drilling of micro-vias in PCB substrates

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 321-326

  Gan, E K W ^a   Zheng, H Y ^a   Lim, G C ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Drilling; Energy resolution; Fiber lasers; Laser beams; Optical materials; Optical microscopy; Optical pulses; Packaging; Production; Scanning electron microscopy

Indexed keywords

ALUMINA; CARBON DIOXIDE; CHIP SCALE PACKAGES; DRILLING; ELECTRONICS PACKAGING; EXCIMER LASERS; FIBER LASERS; LASER BEAMS; LASER PULSES; OPTICAL DATA STORAGE; OPTICAL MATERIALS; OPTICAL MICROSCOPY; ORGANIC POLLUTANTS; PACKAGING; PACKAGING MATERIALS; PRINTED CIRCUIT BOARDS; PRODUCTION; SCANNING ELECTRON MICROSCOPY; SUBSTRATES;

ABSORPTION CHARACTERISTICS; CROSS SECTIONAL ANALYSIS; ENERGY RESOLUTIONS; INTERACTION MECHANISMS; MECHANICAL DRILLING; PROCESS PARAMETERS; SUBSTRATE COMPOSITION; SUBSTRATE MATERIAL;

NEODYMIUM LASERS;

DRILLING; ENERGY; PACKAGING; PRODUCTION; SCANNING ELECTRON MICROSCOPY;

EID: 0042377314     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906394     Document Type: Conference Paper

References (8)

1. Arledge, K. et al, "Microvias in Printed Circuit Design", Proc. IPC Printed Circuits Expo 1998, Long Beach, CA, pp. S17-7-1-S17-7-8.
2. Paulus, J. and Petti, M., "Microvia Materials: Enablers for High-Density Interconnects", Proc. IPC Printed Circuits Expo 1997, San Jose, CA, pp. S17-7-1-S17-7-8.
3. 2 Laser Micro Via Fabrication in Standard and Emerging PWB Dielectrics", Proc. IPC Printed Circuits Expo 1997, San Jose, CA, pp. S15-3-1-S15-3-8.
4. Cable, A., "Improvements in High Speed Laser Microvia Formation Using Solid State Nd:YAG UV Lasers", Proc. IPC Printed Circuits Expo 1997, San Jose, CA, pp. S17-7-1-S17-7-8.
5. Srinivasan, R. et al, "Ultraviolet Ablation of Organic Polymers", Chem. Rev., vol. 89 (1989), pp. 1303-1316.
6. Dyer, P.E., Photochemical Processing of Electronic Materials, ed. Boyd, I.W. and Jackman, R.B., Academic Press (New York, 1992), pp. 359-385.
7. Latta, M. et al, "Excimer Laser Projection Photoetching", J. Appl. Phys., vol. 56, no. 5 (1984), pp. 586-588.
8. Baliga, J., "Ball Grid Arrays: The High Pincount Workhorse", Semiconductor International, September 1997, pp. 81-87.