An accurate transient analysis of high-speed package interconnects using convolution technique

Analog Integrated Circuits and Signal Processing

Volumn 35, Issue 2-3, 2003, Pages 107-120

  Beyene, Wendemagegnehu T ^a   Yuan, Chuck ^a  

^a RAMBUS INC   (United States)

Author keywords

Bandlimiting filter; Convolution techniques; Plastic ball grid array (PBGA) package; Tukey window

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC LOSSES; ELECTRIC CONDUCTORS; FREQUENCY DOMAIN ANALYSIS; INTERCONNECTION NETWORKS; SKIN EFFECT;

HIGH-SPEED PACKAGE INTERCONNECTS; PLASTIC BALL-GRID-ARRAY PACKAGE;

ELECTRONICS PACKAGING;

EID: 0042349705     PISSN: 09251030     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1024170314125     Document Type: Article

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