Liquid dispensing encapsulation in semiconductor packaging

Microelectronics International

Volumn 20, Issue 3, 2003, Pages 29-35

  Yang, Liyu ^a   King, Carl K ^a   Bernstein, Joseph B ^b  

^a INTEL CORPORATION   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Electronic packaging; Encapsulation; Optimization; Semiconductors

Indexed keywords

EID: 0042333228     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360310487927     Document Type: Article

References (1)