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Volumn 6, Issue 1, 1996, Pages 51-63

Yield estimation through component placement accuracy evaluation in surface mount PWB assembly

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0042311577     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S096031319600007X     Document Type: Article
Times cited : (2)

References (11)
  • 1
    • 8744260816 scopus 로고
    • Precision placement of high lead count packages
    • Florida
    • C. Bauer and J. DeCarlo, "Precision placement of high lead count packages", Proc. ISHM, Florida, 1991, pp. 333-338.
    • (1991) Proc. ISHM , pp. 333-338
    • Bauer, C.1    Decarlo, J.2
  • 2
    • 8744304909 scopus 로고
    • Leaded and leadless surface mount joints
    • Packaging, ASM International Materials Park, Ohio
    • K. Frasier, "Leaded and leadless surface mount joints", Electronics Materials Handbook, Vol. 1-Packaging, ASM International Materials Park, Ohio, 1989, pp. 730-734.
    • (1989) Electronics Materials Handbook , vol.1 , pp. 730-734
    • Frasier, K.1
  • 3
    • 0025480656 scopus 로고
    • Achieving perfect SMT component location after reflow
    • Sept.
    • G. Graham, "Achieving perfect SMT component location after reflow", Surface Mount Technology (Sept., 1990), 51-54.
    • (1990) Surface Mount Technology , pp. 51-54
    • Graham, G.1
  • 4
    • 8744262892 scopus 로고
    • Fine pitch technology: Leading SMT components into the 90's
    • June
    • W. K. Jones, "Fine pitch technology: Leading SMT components into the 90's", Electronic Packaging and Production (June, 1990), 16-18.
    • (1990) Electronic Packaging and Production , pp. 16-18
    • Jones, W.K.1
  • 5
    • 0025460669 scopus 로고
    • Key issues in surface mount assembly
    • July
    • K. Kuhn, "Key issues in surface mount assembly", Surface Mount Technology (July, 1990), 13-15.
    • (1990) Surface Mount Technology , pp. 13-15
    • Kuhn, K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.