Yield estimation through component placement accuracy evaluation in surface mount PWB assembly

Journal of Electronics Manufacturing

Volumn 6, Issue 1, 1996, Pages 51-63

  Shih, Wurong ^a   Huang, Y U Wen ^a   Srihari, K ^a   Westby, George R ^b  

^a BINGHAMTON UNIVERSITY   (United States)

^b UNIVERSAL INSTRUMENTS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042311577     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S096031319600007X     Document Type: Article

References (11)

1. C. Bauer and J. DeCarlo, "Precision placement of high lead count packages", Proc. ISHM, Florida, 1991, pp. 333-338.
2. K. Frasier, "Leaded and leadless surface mount joints", Electronics Materials Handbook, Vol. 1-Packaging, ASM International Materials Park, Ohio, 1989, pp. 730-734.
3. G. Graham, "Achieving perfect SMT component location after reflow", Surface Mount Technology (Sept., 1990), 51-54.
4. W. K. Jones, "Fine pitch technology: Leading SMT components into the 90's", Electronic Packaging and Production (June, 1990), 16-18.
5. K. Kuhn, "Key issues in surface mount assembly", Surface Mount Technology (July, 1990), 13-15.
6. A. M. Law and W. D. Kelton, Simulation Modelling and Analysis 2nd ed., McGraw Hill, New York, 1991.
7. F. Neelamkavil, Computer Simulation and Modeling, John Wiley & Sons, New York, 1987.
8. M. Snyder and G. Westby, Parameterization of the Fine Pitch Placement Process, Universal Instruments Corporation, Binghamton, New York, 1990.
9. J. Tuma, Engineering Mathematics Handbook, McGraw Hill, New York, 1979.
10. Universal General Specification: Model 4766A SFP, Surface Mounted Component Placement System, Universal Instruments Corporation, Binghamton, New York, 1991.
11. R. E. Walpole, Probability and Statistics for Engineers and Scientists, MacMillan Publishing Co., New York, NY, 1989.