Fusion-bonded multilayered SOI for MEMS applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4876, Issue 2, 2002, Pages 623-632

  Cole, Dave ^a   McNamara, Cormac ^a   Somasundram, Kumar ^a   Boyle, Anne ^a   Devine, Claire ^a   McKeever, James ^a   McCann, Paul ^a   Nevin, Andy ^a  

^a Analog Devices Inc UK   (United Kingdom)

Author keywords

Bow; Fusion bonding; MEMS; Multilayered SOI; Oxide etching; Silicon on insulator; Stress

Indexed keywords

ANNEALING; BONDING; ETCHING; INTERFACES (MATERIALS); MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MULTILAYERS; OXIDES; STRESSES; THICKNESS CONTROL;

FUSION BONDING;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0042232087     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.463926     Document Type: Conference Paper

References (5)

1. A. Lehto, "SOI Microsensors and MEMS," Silicon-on-Insulator Technology and Devices IX, ECS Proceeding Series PV99-3 (Pennington, N.J.,1999).
2. C. Gormley, A. Boyle, V. Srigengan, and S. Blackstone, "Micromachining and Microfabrication Process Technology 1/1," SPIE Proceedings (2000).
3. Q.-Y. Tong and U. Gosele, "Semiconductor Wafer Bonding: Science and Technology" (ECS, Pennington, N.J., 1999).
4. J.S. Hamel, S. Stefanou, M. Bain, B.M. Armstrong and H.S. Gamble, "IEEE Microwave and Guided Wave Letters," 10, 134 (2000).
5. W.A. Nevin, K. Somasundram, P. McCann, S. Magee and A.T. Paxton, "J. Electrochem. Soc.," 148, G649 (2001).