Comparison of fully three-dimensional optical, normally conducting, and superconducting interconnections

Applied Optics

Volumn 38, Issue 35, 1999, Pages 7264-7275

  Ozaktas, Haldun M ^a   Erden, M Fatih ^b  

^a The Department of Electrical Engineering   (Turkey)

^b Massana Ltd   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042231941     PISSN: 1559128X     EISSN: 21553165     Source Type: Journal    
DOI: 10.1364/AO.38.007264     Document Type: Article

References (19)

1. IEEE, eds., Proceedings of the 45th Electronic Components and Technology Conference (ECTC) (Institute of Electrical and Electronics Engineers, Piscataway, N.J., 1995).
2. H. M. Ozaktas and J. W. Goodman, “The limitations of interconnections in providing communication between an array of points,” in Frontiers of Computing Systems Research, S. K. Tewksbury, ed. (Plenum, New York, 1991), Vol. 2, pp. 61-130.
3. H. M. Ozaktas, “A physical approach to communication limits in computation,” Ph.D. dissertation (Stanford University, Stanford, Calif., 1991).
4. A. L. Rosenberg, “Three-dimensional VLSI: a case study,” J. Assoc. Comput. Mach. 30, 397-416 (1983).
5. F. T. Leighton and A. L. Rosenberg, “Three-dimensional circuit layouts,” J. Comput. Sys. Sci. 15, 793-813 (1986).
6. M. J. Little and J. Grinberg, “The 3-D computer: an integrated stack of WSI wafers,” in Wafer-Scale Integration (Klu-wer, New York, 1988), Chap. 8.
7. H. M. Ozaktas, Y. Amitai, and J. W. Goodman, “A three dimensional optical interconnection architecture with minimal growth rate of system size,” Opt. Commun. 85, 1-4 (1991); errata 88, 569 (1992).
8. H. M. Ozaktas and J. W. Goodman, “Lower bound for the communication volume required for an optically interconnected array of points,” J. Opt. Soc. Am. A 7, 2100-2106 (1990).
9. H. M. Ozaktas, Y. Amitai, and J. W. Goodman, “Comparison of system size for some optical interconnection architectures and the folded multi-facet architecture,” Opt. Commun. 82, 225-228 (1991).
10. H. M. Ozaktas and D. Mendlovic, “Multistage optical interconnection architectures with least possible growth of system size,” Opt. Lett. 18, 296-298 (1993).
11. K. W. Goossen, J. E. Cunningham, and W. Y. Jan, “GaAs 850 modulators solder-bonded to silicon,” IEEE Photonics Technol. Lett. 5, 776-778 (1993).
12. K. W. Goossen, J. A. Walker, L. A. D’Asaro, S. P. Hui, B. Tseng, R. Leibenguth, D. Kossives, D. D. Bacon, D. Dahringer, L. M. F. Chirovsky, A. L. Lentine, and D. A. B. Miller, “GaAs MQW modulators integrated with silicon CMOS,” IEEE Photonics Technol. Lett. 7, 360-362 (1995).
13. H. M. Ozaktas, “Paradigms of connectivity for computer circuits and networks,” Opt. Eng. 31, 1563-1567 (1992).
14. H. M. Ozaktas, H. Oksuzoglu, R. F. W. Pease, and J. W. Goodman, “Effect on scaling of heat removal requirements in three-dimensional systems,” Int. J. Electron. 73, 1227-1232 (1992).
15. H. M. Ozaktas, “Toward an optimal foundation architecture for optoelectronic computing. Part I. Regularly interconnected device planes,” Appl. Opt. 36, 5682-5696 (1997).
16. H. M. Ozaktas, “Toward an optimal foundation architecture for optoelectronic computing, Part II. Physical construction and application platforms,” Appl. Opt. 36, 5697-5705 (1997).
17. H. B. Bakoglu, Circuits, Interconnections, and Packaging for VLSI (Addison-Wesley, Reading, Mass., 1990).
18. W. Nakayama, “On the accomodation of coolant flow paths in high density packaging,” IEEE Trans. Component Hybrids Manuf. Technol. 13, 1040-1049 (1990).
19. W. Nakayama, “Heat-transfer engineering in systems integration—outlook for closer coupling of thermal and electrical designs of computers,” IEEE Trans. Components Packag. Manuf. Technol. Part A 18, 818-826 (1995).