3D FEM models for numerical simulation of induction sealing of packaging material

COMPEL - The International Journal for Computation and Mathematics in Electrical and Electronic Engineering

Volumn 22, Issue 1, 2003, Pages 170-180

  Babini, A ^a   Borsari, R ^a   Dughiero, F ^b   Fontanini, A ^a   Forzan, M ^b  

^a Tetra Brik Packaging System SpA   (Italy)

^b Department of Electrical Engineering ^*  (Italy)

Author keywords

Electrical machines; Finite element method; Packaging

Indexed keywords

FINITE ELEMENT METHOD; MECHANICAL PERMEABILITY; MULTILAYERS; PACKAGING; POWER SUPPLY CIRCUITS; SEALING (CLOSING);

INDUCTION SEALING;

INDUCTION HEATING;

EID: 0042204965     PISSN: 03321649     EISSN: None     Source Type: Journal    
DOI: 10.1108/03321640310452268     Document Type: Conference Paper

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