The right way to assess electronic system reliability: FIDES

Microelectronics Reliability

Volumn 43, Issue 9-11, 2003, Pages 1401-1404

  Charpenel, P ^a   Davenel, F ⁱ   Digout, R ^h   Giraudeau, M ^g   Glade, M ^b   Guerveno, J P ^d   Guillet, N ^d   Lauriac, A ^f   Male, S ^c   Manteigas, D ^d   Meister, R ^e   Moreau, E ^c   Perie, D ^f   Relmy Madinska, F ^a   Retailleau, P ^d  

^a AIRBUS   (France)

^b EUROCOPTER DEUTSCHLAND GMBH   (France)

^c Nexter Munitions   (France)

^d MBDA FRANCE   (France)

^e THALES AVIONICS   (France)

^f THALES RESEARCH AND TECHNOLOGY   (France)

^g THALES   (France)

^h THALES UNDERWATER SYSTEMS   (France)

ⁱ Delegation Generale pour l'Armement   (France)

Author keywords

[No Author keywords available]

Indexed keywords

RELIABILITY; SEMICONDUCTOR RELAYS; THERMAL EFFECTS;

ELECTRONIC SYSTEMS;

INTEGRATED CIRCUITS;

EID: 0042193367     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00250-6     Document Type: Conference Paper

References (7)

1. P. Charpenel and al. "A global reliability assessment approach: FIDES", ESREL 2002 λμ13, March 2002, Lyon, France
2. Mil-HDBK 217 F
3. UTE C 80810: Reliability data handbook: an universal model for reliability prediction of Electronics components, PCBs and equipment's
4. PRISM® Users Manual VI.3 Reliability Analysis Center (RAC)
5. E. Moreau and al. "FIDES", 2002 Military & Aerospace / Avionics COTS Conference, August 2002, San Diego, California
6. S. Male and al., "FIDES", ANADEF Workshop 2002
7. To be published in 2003 Military & Aerospace / Avionics COTS Conference, August 2003, Boston, MA