High speed grinding of silicon nitride with resin bond diamond wheels

Journal of Materials Processing Technology

Volumn 141, Issue 3, 2003, Pages 329-336

  Huang, Han ^a   Yin, Ling ^a   Zhou, Libo ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b IBARAKI UNIVERSITY   (Japan)

Author keywords

High speed grinding; Maximum chip thickness; Removal mechanism; Silicon nitride

Indexed keywords

BRITTLE FRACTURE; DIAMONDS; RESINS; VIBRATIONS (MECHANICAL);

DIAMOND WHEELS;

SILICON NITRIDE;

EID: 0042191757     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(03)00284-X     Document Type: Article

References (12)

1. Inasaki I. Grinding of hard and brittle materials. Ann. CIRP. 36(2):1987;463-471.
2. Malkin S., Hwang T.W. Grinding mechanisms for ceramics. Ann. CIRP. 45(2):1996;569-580.
3. H.K. Tönshoff, T. Lierse, I. Inasaki, Grinding of advanced ceramics, in: S. Jahanmir, M. Ramulu, P. Koshy (Eds.), Machining of Ceramics and Composites, Marcel Dekker, New York, 1999, pp. 118-855.
4. J.A. Kovach, P. Blau, S. Malkin, S. Srinivasan, B. Bandyopadhyay, K. Ziegler, A feasibility investigation of high speed low damage grinding of advanced ceramics, in: Proceedings of the Fifth International Grinding Conference of the SME, vol. I, Cincinnati, OH, 1993.
5. Klocke F., Brinksmeier E., Evans C., Howes T., Inasaki I., Minke E., Tönshoff H.K., Webster J.A., Stuff D. High speed grinding - fundamental and state of art in Europe, Japan and USA. Ann. CIRP. 46(2):1997;715-724.
6. F. Klocke, E. Verlemann, C. Schippers, High-speed grinding of ceramics, in: S. Jahanmir, M. Ramulu, P. Koshy (Eds.), Machining of Ceramics and Composites, Marcel Dekker, New York, 1999, pp. 119-138.
7. Hwang T.W., Evans C.J., Whitenton E.P., Malkin S., Wear I. High speed grinding of silicon nitride with electroplated diamond wheels. I. Wear and wheel life. Manuf. Sci. Eng. ASME. MED-10:1999;431-442.
8. Hwang T.W., Evans C.J., Malkin S. High speed grinding of silicon nitride with electroplated diamond wheels. II. Wheel topography and grinding mechanisms. Manuf. Sci. Eng. ASME. MED-10:1999;443-452.
9. Hwang T.W., Evans C.J., Malkin S. An investigation of high speed grinding with electroplated diamond wheels. Ann. CIRP. 49(1):2000;245-248.
10. S. Jahanmir, H. Xu, L.K. Ives, Mechanisms of material removal in abrasive machining of ceramics, in: S. Jahanmir, M. Ramulu, P. Koshy (Eds.), Machining of Ceramics and Composites, Marcel Dekker, New York, 1999, pp. 11-84.
11. Bifano T.G., Dow T., Scattergood R.O. Ductile-regime: a new technology for machining brittle material. Trans. ASME J. Eng. Ind. 113(5):1991;184-189.
12. I. Marinescu, B. Rowe, L. Yin, H.G. Wobker, Abrasive processes, in: I. Marinescu, H.K. Tönshoff, I. Inasaki (Eds.), Handbook of Ceramics Grinding and Polishing, Noyes Publications, 2000, pp. 94-189.