Guest editorial special section on compound semiconductor microelectronics manufacturing: The future is here

IEEE Transactions on Semiconductor Manufacturing

Volumn 16, Issue 3, 2003, Pages 354-356

  Jaeger, Rolf ^a   Del Alamo, Jesús A ^b   Fukuta, Masumi ^c   Bennett, Herbert S ^d   Snowden, Christopher M ^e  

^a AGILENT TECHNOLOGIES   (United States)

^b Department of Electrical Engineering and Computer Science   (United States)

^c FUJITSU LABORATORIES LTD   (Japan)

^d NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^e Filtronic Plc   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; MICROELECTRONIC PROCESSING; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTING INDIUM PHOSPHIDE; SEMICONDUCTOR GROWTH;

DEVICE DESIGN; MANUFACTURABILITY; MATERIALS GROWTH; ULTRA-HIGH BANDWIDTH;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0041886423     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2003.815634     Document Type: Editorial

References (0)