Validation of electronic package reliability using speckle interferometry

Journal of Electronic Packaging

Volumn 124, Issue 3, 2002, Pages 277-280

  Yeh, H Y ^a   Cote, K ^a  

^a CALIFORNIA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041870374     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1478060     Document Type: Article

References (7)

1. Stout, E. A., et al., 2000, "Mechanical Characterization of Plastic Ball Grid Array Package Flexture Using Moire Interferometry," IEEE Transactions on Advanced Packaging, 23(4), pp. 637-645.
2. Dadkhah, M. S. et al., 1999, "Strain Concentration Measurements in Ceramic Matrix Composites Using Speckle Interometry," Proc. 8th Society of Experimental Mechanics Conf., Cincinnati, Ohio, June.
3. Zhoe, P. et al., 1999, "Thermomechanical Diagnostics of BGA Packages Using Digital Image/Speckle Correlation," Proc. 7th Inter Society Conference on Thermal Phenomena, Vol. 2, pp. 240-245.
4. McKeown, S., 1999, Mechanical Analysis of Electronic Packaging Systems, First Edition, Marcel Dekker.
5. Pecht, M., 1999, Electronic Packaging Materials and Their Properties, CRC Press.
6. Stolkarts V. et al., 1998, "Constitutive and Damage Model for Solder," IEEE 48th ECTC, pp. 379-385.
7. Cote, K., 2000, "Validation of Electronic Package Reliability Using Speckle Interferometry," Master's thesis, California State University of Long Beach.