Improvement of Adhesion for Layer-to-Layer Connection for Built-up Printed Circuit Boards

Plating and Surface Finishing

Volumn 87, Issue 3, 2000, Pages 76-80

  Kobayashi, Takeshi ^b   Ishibashi, Junichi ^b   Honma, Hideo ^a  

^a KANTO GAKUIN UNIVERSITY   (Japan)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041684797     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)

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2. Y. Tsukada, S. Tsuchida & Y. Mashimoto, Proc. 7th IMC, 252 (1991).
3. Y. Uno, Y. Takahashi, S. Ozawa, K. Nakakuki, Y. Iguchi, T. Kanamori & Y. Kasuya, Proc. IMC, WB1-4, 61, (April 1994).
4. H. Honma & T. Fujinami, JIPC (Japan), 6, 209 (1991).
5. T. Fujinami, K. Kou & H. Honma, J. Japan Inst. Electronics Packaging (Japan), 1, 66 (1998).
6. T. Fujinami & H. Honma, J. Surf. Fin. Soc. (Japan), 43, 595 (1992).