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Volumn 2, Issue , 2003, Pages 881-886

Evaluating packaging effectiveness in power electronics

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONVERTERS; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRONICS PACKAGING; MATHEMATICAL MODELS;

EID: 0041656212     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (9)

References (19)
  • 1
    • 0033343303 scopus 로고    scopus 로고
    • Power electronics technology at the dawn of the new millennium - Status and future
    • J.D.Van Wyk, F.C. Lee "Power electronics technology at the dawn of the new millennium - status and future", Proceedings of IEEE PESC'99, pp 46-52.
    • Proceedings of IEEE PESC'99 , pp. 46-52
    • Van Wyk, J.D.1    Lee, F.C.2
  • 3
    • 0034472858 scopus 로고    scopus 로고
    • Engineering science considerations for integration and packaging
    • J.A. Ferreira "Engineering Science Considerations for Integration and Packaging", Proceedings of IEEE PESC'00, Vol. 1, pp 12-18.
    • Proceedings of IEEE PESC'00 , vol.1 , pp. 12-18
    • Ferreira, J.A.1
  • 12
  • 13
    • 0038492595 scopus 로고    scopus 로고
    • The state-of-the-art power electronics technologies and future trends
    • F.C. Lee "The state-of-the-art power electronics technologies and future trends" Power Engineering Society Summer Meeting, Vol. 2, pp 1229-1232.
    • Power Engineering Society Summer Meeting , vol.2 , pp. 1229-1232
    • Lee, F.C.1
  • 16
    • 0042258507 scopus 로고    scopus 로고
    • The development of planar high density hybrid integration technologies for power electronics
    • J.D. van Wyk et al.,"The Development of Planar High Density Hybrid Integration Technologies for Power Electronics", Proceedings of EPE-PEMC 2002
    • (2002) Proceedings of EPE-PEMC 2002
    • Van Wyk, J.D.1
  • 19
    • 2342509920 scopus 로고    scopus 로고
    • Reliability analysis methods of power semiconductor modules
    • D. Katsis, P. McCluskey, J. D. van Wyk, "Reliability Analysis Methods of Power Semiconductor Modules", CPES proceedings, pp. 577-581
    • CPES Proceedings , pp. 577-581
    • Katsis, D.1    McCluskey, P.2    Van Wyk, J.D.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.