Collection Efficiency of Metallic Contaminants on Si Wafer by Vapor-Phase Decomposition-Droplet Collection

Analytical Sciences

Volumn 17, Issue 5, 2001, Pages 653-658

  Chung, Hye Young ^a   Kim, Young Hun ^a   Cho, Hyo Yong ^a   Lee, Bo Young ^a   Yoo, Hak Do ^a   Lee, Sang Hak ^b  

^a LG Siltron Inc   (South Korea)

^b Kyungpook National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONTAMINATION; COPPER COMPOUNDS; DROPS; EFFICIENCY; HYDROGEN PEROXIDE; INDUCTIVELY COUPLED PLASMA MASS SPECTROMETRY; METALS; MIXTURES; SUBSTRATES;

COLLECTION EFFICIENCY; DOPANT CONCENTRATIONS; INDUCTIVELY COUPLED PLASMA MASS SPECTROMETRIES (ICPMS); METALLIC CONTAMINANTS; POLISHED SILICONS; SAMPLE PREPARATION PROCEDURE; SILICON WAFER SURFACE; VAPOR PHASE DECOMPOSITION-DROPLET COLLECTIONS;

SILICON WAFERS;

EID: 0041639476     PISSN: 09106340     EISSN: None     Source Type: Journal    
DOI: 10.2116/analsci.17.653     Document Type: Article

References (19)

1. W. Kern, in "Handbook of Semiconductor Wafer Cleaning Technology", ed. W. Kern, 1992, Noyes Publications, Park Ridge, 8.
2. W. Kern, in "Handbook of Semiconductor Wafer Cleaning Technology", ed. W. Kern, 1992, Noyes Publications, Park Ridge, 596.
3. H. Nagasawa and M. Enomoto, Bunseki Kagaku, 1997, 46, 375.
4. L. H. Hall, J. A. Sees, and B. L. Schmidt, Surf. Interface Anal., 1996, 24, 511.
5. R. S. Hockett, in "Handbook of Semiconductor Wafer Cleaning Technology", ed. W. Kern, 1992, Noyes Publications, Park Ridge, 584.
6. A. Shimazaki, H. Hiratsuka, Y. Matsushita, and S. Yoshii, Extended Abstracts of the 16th Conference on Solid State Devices and Materials, 1984, 281.
7. Y. Tanizoe, S. Sumita, M. Sano, N. Fujino, and T. Shiraiwa, Bunseki Kagaku, 1989, 34, 177.
8. M. Takenaka, Y. Yamada, M. Hayashi, H. Omori, S. Ito, and A. Okada, Bunseki Kagaku, 1997, 46, 743.
9. G. Settembre and E. Debrah, Micro, 1998, 16, 79.
10. K. Fujiwara, Y. Toumori, H. Mitsumata, M. Inada, and T. Nakahara, Bunseki Kagaku, 1999, 48, 681.
11. M. Yamagami, M. Nonoguchi, T. Yamada, T. Shoji, T. Utaka, Y. Mori, S. Nomura, K. Taniguchi, H. Wakata, and S. Ikeda, Bunseki Kagaku, 1999, 48, 1005.
12. R. S. Hockett, Anal. Sci., 1995, 11, 511.
13. S. Pahike, L. Kotz, T. Ehmann, P. Eichinger, and A. Huber, in "Proceedings of the Eighth International Symposium on Silicon Materials Science and Technology", ed. H. R. Huff, H. Ysuya, and U. Gösele, 1998, ECS, San Diego, California, 1524-1540.
14. H. Morinaga, M. Suyama, M. Nose, S. Verhaverbeke, and T. Ohmi, IEICE TRANS. ELECTRON., 1996, E79C, 343.
15. H. Seidel, L. Csepregi, A. Heuberger, and H. Baumgartel, J. Electrochem. Soc., 1993, 137, 3626.
16. T. Ohmi, T. Imaoka, T. Kezuka, J. Takano, and M. Kogure, J. Electrochem. Soc., 1993, 140, 811.
17. H. Morinaga and T. Ohmi, in "Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing", ed. R. E. Novak and J. Ruzyllo, 1995, ECS, Chicago, Illinois, 257-268.
18. V. Bertagna, F. Rouelle, and M. Chemla, Semicond. Sci. Technol., 1998, 13, 444.
19. G. M. Choi, H. Morita, H. Morinaga, J. S. Kim, and T. Ohmi, in "Proceedings of the Sixth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing", ed. T. Hattori, R. E. Novak, and J. Ruzyllo, 1999, ECS, Honolulu, 272-279.