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Volumn 62, Issue 12, 1993, Pages 1435-1437

Multichip module using multilayer YBa2Cu3O 7-δ interconnects

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0041635643     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.108652     Document Type: Article
Times cited : (31)

References (10)
  • 2
    • 0026910880 scopus 로고
    • For example, The authors describe the need for 65 interconnect layers in the IBM ES/9000 MCM, 63 thick film layers which use [formula omitted] linewidths, [formula omitted] pitch, and 2 thin film layers which use [formula omitted] linewidths, [formula omitted] pitch.
    • (1992) IEEE Trans. Comp. Hybrids, Manuf. Technol. , vol.15 , pp. 426
    • Tummala, R.R.1    Ahmed, S.2
  • 4
    • 84950575774 scopus 로고    scopus 로고
    • CD4009UBH type Hex Buffer (Inverting), manufactured by RCA Solid State Division.
  • 5
    • 84950575777 scopus 로고    scopus 로고
    • CD4040BH type 12-Stage Ripple Carry Binary Counter, manufactured by RCA Solid State Division.
  • 10
    • 84950575776 scopus 로고    scopus 로고
    • GE-7031 varnish manufactured by the General Electric Corp., Schenectady, New York.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.