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Volumn 62, Issue 12, 1993, Pages 1435-1437
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Multichip module using multilayer YBa2Cu3O 7-δ interconnects
a a a a a
a
Conductus Inc
*
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 0041635643
PISSN: 00036951
EISSN: None
Source Type: Journal
DOI: 10.1063/1.108652 Document Type: Article |
Times cited : (31)
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References (10)
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