Investigation on an integrated liquid cooling system in LTCC-multilayer

Proceedings of the International Spring Seminar on Electronics Technology

Volumn 2001-January, Issue , 2001, Pages 178-182

  Bauer, R ^a   Strickert, V ^b   Wolter, K J ^b   Sauer, W ^b   Leonescu, D ^c   Svasta, P ^c  

^a UNIVERSITY OF APPLIED SCIENCES DRESDEN   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^c UNIVERSITY POLITEHNICA OF BUCHAREST   (Romania)

Author keywords

[No Author keywords available]

Indexed keywords

CONCURRENT ENGINEERING; COOLING SYSTEMS; ELECTRONICS PACKAGING; HEAT TRANSFER; LIQUIDS; THERMAL MANAGEMENT (ELECTRONICS); THERMOELECTRIC EQUIPMENT;

CERAMIC MULTILAYERS; DESIGN AND TECHNOLOGY; ELECTRONIC PACKAGING; EXPERIMENTAL INVESTIGATIONS; LIQUID COOLING SYSTEMS; MATERIAL SELECTION; MEASUREMENT AND SIMULATION; MULTILAYER DESIGNS;

MULTILAYERS;

EID: 0041628298     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2001.931046     Document Type: Conference Paper

References (4)

1. th International Symposium on Microelectronics Technology and Microsystems, Zwickau, 26./27.10.2000
2. Bauer, R.; Rebenklau, L.; Luniak, M.; K.-J. Wolter: Mikrotechnische Applikationen mit der Dickfilmtechnik Deutsche ISHM Konferenz '98, München Oktober 1998
3. th International Symposium SIITME '99; Bucharest
4. Leonescu, D.; Svasta, P.; Bauer, R.; Sauer, W.: Thermal Analysis of a Power Module Using Flotherm ISSE 2001 Calimanesti-Caciulata, May 2001