Forecasting the Next Electronic System-Integration Researching Phase II-ASET Actual Researching and Future Target

Journal of Japan Institute of Electronics Packaging

Volumn 4, Issue 3, 2001, Pages 185-191

  Bonkohara, Manabu ^a  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041610708     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.4.185     Document Type: Article

References (4)

1. M. Bonkohara: “JAPAN Activity in 1999 Electronic System-Integration Technology”, 6Th Annual KGD Industrial Workshop, Napa Valley, 1999.
2. M. Bonkohara, M. Ishino: “Activity for 21C Electronic System Integration Technology Consortium in Japan”, CAST2000, p.23, 2000.
3. The Proceedings of the Annual Report Meeting of ESI Dept. ASET, 2000.
4. Y. Tomita et al.: “Copper Bump Bonding with Electroless Metal Cap on 3Dimensional Stacked Structure”, 3rd Electronics Packaging Technology Conference, Singapore, 2000.