Propagation characteristics of substrate integrated waveguide based on LTCC

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2003, Pages 2045-2048

  Li, Hao ^a   Hong, Wei ^a   Cui, Tie Jun ^a   Wu, Ke ^a,b   Zhang, Yu Lin ^a   Yan, Li ^a  

^a SOUTHEAST UNIVERSITY   (China)

^b POLY GRAMES RESEARCH CENTER   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CERAMIC MATERIALS; ELECTROMAGNETIC WAVE PROPAGATION; FINITE DIFFERENCE METHOD; MULTILAYERS; PRINTED CIRCUIT BOARDS; SUBSTRATES;

LOW-TEMPERATURE CO-FIRED CERAMICS (LTCC);

RECTANGULAR WAVEGUIDES;

EID: 0041589587     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. D. Deslandes and K. Wu, "Integrated transition of coplanar to rectangular waveguides," in IEEE MTT-S Int. Microwave Symp. Dig., vol. 2, pp. 619-622. Feb. 2001.
2. D. Deslandes and K. Wu, "Integrated microstrip and rectangular waveguide in planar form," IEEE Microwave Wireless Components Lett., vol. 11, pp. 68-70, Feb. 2001.
3. K. Wu and Boone F., "Guided-wave properties of synthesized nonradiative dielectric waveguide for substrate integrated circuits (SICs)," in IEEE MTT-S Int. Microwave Symp. Dig., vol. 2, pp. 723-726, 2001.
4. A. Zeid and H. Baudrand, "Electromagnetic scattering by metallic holes and its applications in microwave circuit design," IEEE Trans. Microwave Theory Tech., vol. 50, no. 4, pp. 1198-1206, Apr. 2002.
5. K. Wu, "Integration and interconnect techniques of planar and non-planar structures for microwave and millimeter-wave circuits - current status and future trend," 2007 Asia-Pacific Microwave Conf. Proc. (APMC'01), pp. 411-416, Taiwan, Dec. 3-6 (invited paper).