Electroless Ni-Fe-B alloy plating solution using DMAB as a reducing agent

Plating and Surface Finishing

Volumn 83, Issue 2, 1996, Pages 78-80

  Kim, D ^a   Matsuda, H ^a   Aoki, K ^a,b   Takano, O ^a,c  

^a UNIVERSITY OF HYOGO   (Japan)

^b Osaka Prefecture University

^c OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041518532     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (7)

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2. A.F. Schmeckenbecher, Plating, 58, 905 (1971).
3. M. Matsuoka and T. Hayashi, Plat. and Surf. Fin., 69, 53 (1982).
4. H. Matsuda and O. Takano, J. Met. Fin. Japan, 38, 429 (1987).
5. H. Matsubara, H. Mizutani, S. Mitamura, and T. Osaka, Trans. IEEE Magn., 26, 1210 (1990).
6. T. Osaka, T. Homma, K. Noda, T. Watanabe, and F. Goto, Trans. IEEE Magn., 27, 4963 (1990).
7. D-H. Kim, H. Matsuda, K. Aoki, and O. Takano, Jpn. J. Sur. Fin., 45, 202 (1994).