Effects of processing and doping elements on the grain boundary microstructure and mechanical properties of SiC

Key Engineering Materials

Volumn 247, Issue , 2003, Pages 331-334

  Tsurekawa, S ^a   Naito, Y ^a   Murthy, V S R ^a,c   Watanabe, T ^a   Tamari, N ^b  

^a TOHOKU UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^c INDIAN INSTITUTE OF TECHNOLOGY KANPUR   (India)

Author keywords

Coincidence Boundaries; Doping Elements; Grain Growth; Hardness; Hot Pressing; SiC; Spark Plasma Sintering SPS

Indexed keywords

DOPING (ADDITIVES); GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; HARDNESS; HOT PRESSING; MAGNESIUM PRINTING PLATES; MICROSTRUCTURE; SINTERING;

SPARK PLASMA SINTERING (SPS);

SILICON CARBIDE;

EID: 0041429584     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

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