Effects of the temperature, humidity, and stress on the interlaminar interface of carbon fiber polymer-matrix composites, studied by contact electrical resistivity measurement

Journal of Adhesion

Volumn 78, Issue 2, 2002, Pages 189-200

  Wang, Shoukai ^a   Kowalik, Daniel P ^a   Chung, D D L ^a  

^a the State University of New York   (United States)

Author keywords

Carbon fiber; Composite; Electrical resistivity; Epoxy; Humidity; Polymer

Indexed keywords

CARBON FIBERS; ELECTRIC CONDUCTIVITY MEASUREMENT; ELECTRONS; HUMIDITY CONTROL; NONMETALLIC MATRIX COMPOSITES; ORGANIC POLYMERS; STRESSES; THERMAL EFFECTS;

CARBON FIBER POLYMER MATRIX COMPOSITE; INTERLAMINAR INTERFACE; REVERSIBLE EFFECTS;

INTERFACES (MATERIALS);

EID: 0041402698     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218460210384     Document Type: Article

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