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Volumn 30, Issue 14, 2003, Pages 2175-2189

Component scheduling for chip shooter machines: A hybrid genetic algorithm approach

Author keywords

Chip shooter machines; Component scheduling; Genetic algorithms; Heuristics; Printed circuit board manufacturing

Indexed keywords

GENETIC ALGORITHMS; HEURISTIC METHODS; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY;

EID: 0041386432     PISSN: 03050548     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0305-0548(02)00129-6     Document Type: Article
Times cited : (66)

References (21)
  • 1
    • 0023981635 scopus 로고
    • Sequencing of insertions in printed circuit board assembly
    • Ball MO, Magazine MJ. Sequencing of insertions in printed circuit board assembly. Operations Research 1988;36(2):192-201.
    • (1988) Operations Research , vol.36 , Issue.2 , pp. 192-201
    • Ball, M.O.1    Magazine, M.J.2
  • 2
    • 0024748687 scopus 로고
    • IC insertion: An application of the travelling salesman problem
    • Chan D, Mercier D. IC insertion: an application of the travelling salesman problem. International Journal of Production Research 1989;27(10):1837-41.
    • (1989) International Journal of Production Research , vol.27 , Issue.10 , pp. 1837-1841
    • Chan, D.1    Mercier, D.2
  • 5
    • 0029356165 scopus 로고
    • Intelligent optimization of component insertion in multi-head concurrent operation PCBA machines
    • Souza RD, Wu LJ. Intelligent optimization of component insertion in multi-head concurrent operation PCBA machines. Journal of Intelligent Manufacturing 1995;6:235-43.
    • (1995) Journal of Intelligent Manufacturing , vol.6 , pp. 235-243
    • Souza, R.D.1    Wu, L.J.2
  • 6
    • 0000347064 scopus 로고    scopus 로고
    • SMT feeder slot assignment for predetermined component placement paths
    • Moyer LK, Gupta SM. SMT feeder slot assignment for predetermined component placement paths. Journal of Electronics Manufacturing 1996;6(3):173-92.
    • (1996) Journal of Electronics Manufacturing , vol.6 , Issue.3 , pp. 173-192
    • Moyer, L.K.1    Gupta, S.M.2
  • 7
    • 0000008295 scopus 로고    scopus 로고
    • Simultaneous component sequencing and feeder assignment for high speed chip shooter machines
    • Moyer LK, Gupta SM. Simultaneous component sequencing and feeder assignment for high speed chip shooter machines. Journal of Electronics Manufacturing 1996;6(4):271-305.
    • (1996) Journal of Electronics Manufacturing , vol.6 , Issue.4 , pp. 271-305
    • Moyer, L.K.1    Gupta, S.M.2
  • 8
    • 0030126950 scopus 로고    scopus 로고
    • Efficient operation of a surface mounting machine with a multihead turret
    • Sohn J, Park S. Efficient operation of a surface mounting machine with a multihead turret. International Journal of Production Research 1996;34(4):1131-43.
    • (1996) International Journal of Production Research , vol.34 , Issue.4 , pp. 1131-1143
    • Sohn, J.1    Park, S.2
  • 11
    • 0031315952 scopus 로고    scopus 로고
    • Optimization of high-mix printed circuit card assembly using genetic algorithms
    • Dikos A, Nelson PC, Tirpak TM, Wang W. Optimization of high-mix printed circuit card assembly using genetic algorithms. Annals of Operations Research 1997;75:303-24.
    • (1997) Annals of Operations Research , vol.75 , pp. 303-324
    • Dikos, A.1    Nelson, P.C.2    Tirpak, T.M.3    Wang, W.4
  • 12
    • 0000731046 scopus 로고    scopus 로고
    • An efficient assembly sequencing heuristic for printed circuit board configurations
    • Moyer LK, Gupta SM. An efficient assembly sequencing heuristic for printed circuit board configurations. Journal of Electronics Manufacturing 1997;7(2):143-60.
    • (1997) Journal of Electronics Manufacturing , vol.7 , Issue.2 , pp. 143-160
    • Moyer, L.K.1    Gupta, S.M.2
  • 15
    • 0027874715 scopus 로고
    • Planning of component placement/insertion sequence and feeder setup in PCB assembly using genetic algorithm
    • Leu MC, Wong H, Ji Z. Planning of component placement/insertion sequence and feeder setup in PCB assembly using genetic algorithm. Journal of Electronic Packaging 1993;115:424-32.
    • (1993) Journal of Electronic Packaging , vol.115 , pp. 424-432
    • Leu, M.C.1    Wong, H.2    Ji, Z.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.