The influence of the thermal conductivity on the heat transfer performance in a heat sink

Journal of Electronic Packaging

Volumn 124, Issue 3, 2002, Pages 164-169

  Ma, H B ^a   Peterson, G P ^b  

^a University of Missouri   (United States)

^b Department of Electrical and Computer Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041369679     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1478058     Document Type: Article

References (6)

1. Ma. H. B., and Peterson, G. P., 1998, "High Heat Flux Cooling Devices for Desktop Computers," Technical Report, Intel Corporation.
2. Peterson, G. P., 1994, An Introduction to Heat Pipes, Wiley, New York.
3. Benson, D. A., Adkins, D. R., Mitchell, R. T., Tuck, M. R., Palmer, D. W., and Peterson, G. P., 1998, "Ultra High Capacity Micro Machined Heat Spreaders," Microscale Thermophysical Engineering, 2(1), pp. 21-29.
4. Mansuria, M. S., and Kamath, V., 1994, "Design Optimization of a High-Performance Heat-Sink/Fan Assembly," Heat Transfer in Electronic Systems, ASME HTD-Vol. 292, pp. 95-104.
5. Wirtz, R. A., Sohal, R., and Wang, H., 1997, "Thermal Performance of Pin-Fin Fan-Sink Assemblies," ASME J. Electron. Packag., 119(1), pp. 26-31.
6. Ma, H. B., Teoh, C. K., and Maschmann, M. R., 2001, "Low Cost Thermal Management for Desktop Computers," Technical Report, Intel Corporation.