Activation energies of intermetallic compound growth at interface between Sn-5Bi-3.5Ag solder and Cu substrate

Materials Science and Technology

Volumn 19, Issue 8, 2003, Pages 1101-1106

  Yoon, J W ^a   Lee, C B ^b   Jung, S B ^a  

^a Sungkyunkwan University   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; INTERFACES (MATERIALS); INTERMETALLICS; REACTION KINETICS; THICKNESS MEASUREMENT;

DIFFUSION COUPLES;

TIN COMPOUNDS;

BISMUTH; COPPER; SILVER; TIN;

ARTICLE; CORRELATION COEFFICIENT; DIFFUSION COEFFICIENT; ENERGY; GROWTH RATE; ISOTHERM; LINEAR REGRESSION ANALYSIS; QUANTITATIVE ANALYSIS; REACTION ANALYSIS; TEMPERATURE DEPENDENCE; THICKNESS;

EID: 0041319081     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708303225003063     Document Type: Article

References (16)

1. J. A. KERN, M. W. WEISER, C. A. DREWIEN, F. J. YOST and S. SACKINGER: Sandia Report, SAND 96-1431, 1-5; Sandia Nat. Lab., June 1996.
2. C. B. LEE, S. B. JUNG, Y. E. SHIN and C. C. SHUR: Mater. Trans., 2001, 42, 751-755.
3. K. SUGANUMA and Y. NAKAMURA: J. Jpn. Inst. Met., 1995, 59, 1299-1305.
4. D. R. FLANDERS, E. G. JACOBS and R. F. PINIZZOTTO: J. Electron. Mater., 1997, 26, 883-887.
5. W. YANG and R. W. MESSLER JR: J. Electron. Mater., 1994, 23, 765-772.
6. W. YANG, L. E. FELTON and R. W. MESSLER JR: J. Electron. Mater., 1995, 24, 1465-1472.
7. S. W. CHEN and Y. W. YEN: J. Electron Mater., 1999, 28, 1203-1208.
8. P. T. VIANCO, P. F. HLAVA and A. C. KILGO: J. Electron. Mater., 1994, 23, 583-594.
9. Y. WU, J. A. SEES, C. POURAGHABAGHER, L. A. FOSTER, J. L. MARSHALL, E. G. JACOBS and R. F. PINIZZOTTO: J. Electron. Mater., 1993, 22, 769.
10. P. T. VIANCO, K. L. ERICKSON and P. L. HOPKINS: J. Electron. Mater., 1994, 23, 721.
11. S. CHOI, T. R. BIELER, J. P. LUCAS and K. N. SUBRAMANIAN: J. Electron. Mater., 1999, 28, 1209-1215.
12. A. J. SUNWOO, J. W. MORRIS, JR and G. K. LUCEY JR: Metall. Trans. A, 1992, 23A, 1323-1332.
13. S. JIN and M. MCCORMACK: J. Electron. Mater., 1994, 23, 735-739.
14. P. SHEWMON: 'Diffusion in solids', 2nd edn, 71-75; 1989, Warrendale, PA, TMS.
15. J. BURKE: in 'The kinetics of phase transformations in metals', translated from English by K. Hirano and H. Hori, 190; 1972, Tokyo, Kyoritsu.
16. C. B. LEE, S. J. SUH, Y. E. SHIN, C. C. SHUR and S. B. JUNG: Proc. 8th Symp. on 'Microjoining and assembly technology in electronics', 2002, Japan Welding Society, 351-356.