Thermal simulation of semiconductor ICs: General and practical approach

Microelectronics Journal

Volumn 28, Issue 3, 1997, Pages 221-227

  Koval, Vladimir A ^a   Fedasyuk, Dmytro V ^a  

^a LVIV POLYTECHNIC NATIONAL UNIVERSITY   (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041163508     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(96)00026-2     Document Type: Article

References (4)

1. V.A. Koval, A.I. Ostapchuk, I.W. Farmaga and D.V. Fedasyuk, CAD: the numerical and analytical methods combined for the analysis of IC's thermal fields, Proc. EURO-DAC '93, 1993, pp. 290-293.
2. C. Mitchell and H.M. Berg, Thermal studies of a plastic dual-in-line package, IEEE Trans. Components, Hybrids, Manufacturing Technol., CHMT-2(4) (Dec. 1979) 500-511.
3. K.E. Manchester and D.W. Bird, Thermal resistance: a reliability consideration, IEEE Trans. Components, Hybrids, Manufacturing Technol., CHMT-3(4) (Dec. 1989) 580-587.
4. V.A. Koval and D.V. Fedasyuk, Multilevel thermal simulation of MCM's by System 'MONSTR-M', Proc. The European Design and Test Conference (ED&TC 1995), Paris, France, 6-9 March 1995, pp. 544-548.