Thermal characterization of microsystems by means of high-resolution thermography

Microelectronics Journal

Volumn 28, Issue 3, 1997, Pages 327-335

  Ashauer, M ^a   Ende, J ^a   Glosch, H ^a   Haffner, H ^a   Hiltmann, K ^a  

^a Institute für Mikro und Informationstechnik   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041163505     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(96)00036-5     Document Type: Article

References (6)

1. F.F. Oettinger, D.L. Blackburn and S. Rubin, Thermal characterization of power transistors, IEEE Trans. Electron Devices, ED-23 (1976) 831-838.
2. Hamamatsu Photonics, Infrared Detectors, Hamamatsu, JP, Hamamatsu Photonics K.K., Solid State Division, Publication No. KIRD0001E02, 1993.
3. B. Schönbach, Software Erika 3.00 Reference Manual, Darmstadt, D, AGEMA GmbH, 1992 (AGEMA Publication 556 960), Company publication.
4. J. Ende, Thermische Charakterisierung von Bauteilen und Materialien der Mikromechanik, IMIT, Villingen-Schwenningen, Graduation Thesis, 1994.
5. INSPEC, IEE, Properties of Silicon, IEE, London, 1988.
6. W. Lang, K. Kühl and H. Sandmaier, Absorbing layers for infrared detectors, Sensors and Actuators A, 34 (1992) 243-248.