Thermal investigation of monolithic structures

Microelectronics Journal

Volumn 28, Issue 3, 1997, Pages 317-325

  Kohari Zs ^a   Csendes, A ^a   Szekely V ^a   Rencz, M ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041163305     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(96)00035-3     Document Type: Article

References (9)

1. Zs. Kohári and A. Csendes, Thermal investigation of microstructures by different simulation and measurement tools, in Papers of the THERMINIC Workshop, Grenoble, France, Sept. 1995.
2. A. Csendes, V. Székely and M. Rencz, Resolution, accuracy and other features of liquid crystal thermal mapping, in Papers of the THERMINIC Workshop, Grenoble, France, Sept. 1995.
3. SYSTUS: User's Manual, Revision A and SYSTHERM: Advanced Thermics Manual, Revision A, Framasoft, Sept. 1992.
4. V. Székely and A. Poppe, Novel tools for thermal and electrical analysis of circuits, Electrosoft, 1(4) (1990) 234-252.
5. A. Napieralski and G. Jablonski, PYRTHERM for Windows - user friendly thermal CAD software, in Papers of the THERMINIC Workshop, Grenoble, France, Sept. 1995.
6. A.G. Kokkas, Thermal analysis of multiple layer structures. IEEE Trans. Electron Devices, V.ED-21(11) (1974) 674-681.
7. H.S. Carslaw and J.C. Jaeger, Conduction of Heat in Solids, 2nd edn, Clarendon Press, Oxford, 1959.
8. A. Csendes, V. Székely and M. Rencz, Thermal mapping with liquid crystal method, in Papers of the 5th European Conf. on Electron and Optical Beam Testing of Electronic Devices, Wuppertal, Germany, Aug. 1995.
9. R. Weyl, B. Lischke, R. Kappelmeyer and F. Beck, Thermographie an integrierten Schaltungen, NTG-Fachberichte, VDE-Verlag GmbH, Berlin, Offenbach, 1985.