Primary creep deformation behaviors related with lamellar interface in TiAl alloy

Metals and Materials International

Volumn 4, Issue 1, 1998, Pages 33-37

  Cho, Han Seo ^a   Nam, Soo Woo ^c   Kim, Young Won ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b UES INC   (United States)

^c NONE

Author keywords

Activation energy; Creep; Dislocation; Primary stage; TiAl

Indexed keywords

ACTIVATION ENERGY; BINARY ALLOYS; CREEP; DISLOCATIONS (CRYSTALS); HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; LAMELLAR STRUCTURES; STRAIN; TITANIUM ALLOYS; TITANIUM METALLOGRAPHY;

AIR ENVIRONMENT; CREEP CONDITIONS; CREEP RATES; CREEP STRAIN; DISLOCATION CLIMB; LAMELLAR INTERFACES; PRIMARY CREEP; TIAL;

TUNGSTEN COMPOUNDS;

EID: 0040679950     PISSN: 12259438     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03026062     Document Type: Article

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