Correlation between the microstructure and corrosion performance of electrolytic tinplate

Protection of Metals

Volumn 32, Issue 2, 1996, Pages 190-193

  Zumelzu, E ^a   Cabezas, C ^a  

^a UNIVERSIDAD AUSTRAL DE CHILE   (Chile)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0040520843     PISSN: 00331732     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. Renard, J.F. and Gellez, J., Tinplate Specification for New Applications, Proc. 5th International Tinplate Conference I.T.R.I., London, England, October, 1992, pp. 1-11.
2. Catalá, R., Panorámica Actual de la Tecnologia de los Envases de Hojalata, Rev. Agroquímica de Alimentos, no. 307, 1989, pp. 145-157.
3. Cabezas, C. and Zumelzu, E., Aravena, D., Combination of Techniques for the Study of Solids in Electrolytic Tinplates, Proc. V CONAMET, Concepción, Chile, October, 1992, pp. 175-179.
4. Zumelzu, E. and Cabezas, C., Tinplate Functionality Characterization by Electron Microscopy for Quality Control, Proc. 2nd Interamerican Congress on Electron Microscopy, Cancun, Mexico, 1993, pp. 1-12.